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Winbond

Official website: http://www.winbond.com/hq/enu

Winbond Electronics was founded in 1987 September, 1995 in Taiwan stock exchange listing. Today's Winbond memory integrated circuit company professional positioning, the main business include product design, technology research and development, manufacturing, marketing and customer serviceservice wafer, is committed to the semiconductor design and advanced production technology, to provide special customer specifications memory solution.

Winbond electronics with DRAM product business group "," flash IC group "and"memory IC manufacturing group in the three major business groups as the core,the continuous pursuit of innovation of products and technologies, in order to implement the competitive advantage. DRAM products, with high speed and low power memory core design technology are good at, launched Specialty DRAMand Mobile Pseudo, including SRAM and Low Power SDRAM RAM series product can be widely used in consumer (Consumer), communication(Communication), computer peripheral electronic (Computer Peripheral) and vehicle (Automobile in four areas,) and double data rate (Double Data Rate /DDR) Graphics DRAM-GDDR products, the lock of personal computers, game consoles and multimedia applications to market demand for high efficiency and high speed graphics memory solution.

Flash memory products, focusing on low density Parallel and Serial two NORFlash, the company's NOR Flash products with its own twelve inch wafer factoryequipped with advanced production process technology, with characteristics of low power consumption, small volume and cost structure better, at present has been the world's major personal computer and peripheral, CD driver, wireless network, DSL modem, DVD players, set-top box and TV set used by manufacturers, especially in the main board and drive market occupies a veryhigh market share.

IC memory products manufacturing, continue to maintain a good relationship with international manufacturers, has advanced process technology, not onlyprovides partners with high quality and high yield of wafer foundry service, at the same time, with the cost structure and flexible capacity allocation, to produce its own niche type DRAM and NOR Flash products, can fully meet the marketdemand driven, stable growth and profit company.

Winbond company corporate headquarters is located in the central Taiwan Science Park of twelve inch wafer fab, to further maintain good relationship withcustomers and strengthening regional support services, Winbond in the United States, Japan and Hongkong, are equipped with a stronghold. In addition,Winbond team accumulated rich experience and intelligence, patent number andquality, the pursuit of excellence and innovation, Winbond is future sustained efforts to target; in product quality, through the production process control andproduct strict pipe work, strengthen the effectiveness of yield enhancement,supply chain management and customer satisfaction, in addition in the company,also obtained IECQ, ISO9001, ISO14001 and QS9000 international qualitycertification for sure.

Winbond believe that the strength of a team is the root of the enterprise,Winbond requires each employee, there must be "responsible, innovation,agglomeration effect" of the work of the spirit, and the work culture rooted in thecompany's various business activities, to Achieve Inc strategy goal, at the same time, provide employees with a safe working environment for energy, internalbuild perfect training courses, promotion channels and the welfare system, and won the Council of labor affairs will be awarded "honour friendly workplacecertification".

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Address: Shenzhen city Baoan street Xixiang Baoyuan Road No. 1053 capital XinDa Daxia room 1013 Tel:0755-23480859 粤ICP备14087593号